OuvertAccord de coopérationÉligibilité pas encore vérifiée

CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment

National Institute of Standards and Technology · CHIPS Incentives Program (11.037)

Publié 29 sept. 2023 · 24 jours restants

En clair

Résumé pas encore disponible en français ; affiché en anglais.

The US National Institute of Standards and Technology funds construction, expansion, or modernization of semiconductor manufacturing and materials facilities through the CHIPS Incentives Program. Eligible applicants are nonprofits, private companies, or consortia with demonstrated ability to finance and build such facilities, with applications due by 1 November 2026.

Un résumé généré du texte du bailleur ; la formulation originale figure ci-dessous.

Résumé

Texte original du bailleur (anglais)

The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the second Notice of Funding Opportunity under this program and seeks applications for projects for the construction, expansion, or modernization of commercial facilities for semiconductor materials and manufacturing equipment.

For more information, additional resources, and instructions on how to apply, please visit chips.gov. Note that all applications must be submitted through the CHIPS Incentives Portal at https://applications.chips.gov. If you have any questions on how to apply, please email apply@chips.gov.

Extrait de la page du bailleur. Le texte intégral, les annexes et les formulaires se trouvent dans l'appel original.

Qui peut candidater

  • ONG / société civile
  • Entreprise privée
  • Consortium obligatoire

Éligibilité et conditions

Afficher le texte d'éligibilité de la source · Texte original du bailleur (anglais)

Applicant types: Others (see text field entitled "Additional Information on Eligibility" for clarification)

An applicant must be a “covered entity” to receive CHIPS Incentives. For purposes of this NOFO, a “covered entity” means a nonprofit entity; a private-sector entity; a consortium of private-sector entities; or a consortium of nonprofit, public, and private-sector entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to the fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors or semiconductor manufacturing equipment.

Thèmes