International collaboration EU and Japan on semiconductors
European Commission · Digital Europe Programme (DIGITAL)
Publicada 7 jul 2026 · Quedan aproximadamente 2 meses
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Resumen aún no disponible en español; se muestra en inglés.
The European Commission funds research and innovation projects on advanced semiconductor technologies including 3D packaging and chiplet interfaces to support AI, with budgets of 3 to 5 million euros per project. Consortia of EU-based organisations must demonstrate solutions at Technology Readiness Levels 5-7 with applications in English by 8 December 2026.
Un resumen generado del texto del donante; la redacción original figura más abajo.
Resumen
Texto original del donante (inglés)
Expected Outcome:
Projects are expected to contribute to the following expected outcomes:
Advanced heterogeneous integration, particularly in 2.5D and 3D packaging and integrated photonics, to support AI functionalities.
Standardised chiplet interfaces, enabling interoperability and fostering a dynamic chiplet ecosystem
Expected outcomes should have direct and immediate impact on European industry.
Furthermore, proposed projects should demonstrate solutions across laboratory and pilot environments, with verification in semiconductor manufacturing use cases. The centre of gravity of envisaged work should address Technology Readiness Levels 5-7. Proposals also need to facilitate knowledge transfer and promote stakeholder engagement through industry workshops, publications, and networking events.
Extracto de la página del donante. El texto completo, los anexos y los formularios están en la convocatoria original.
Regiones elegibles
- Estados miembros de la UE
Quién puede presentar una solicitud
- ONG / sociedad civil
- Institución académica o de investigación
- Empresa privada
- Organismo gubernamental
Elegibilidad y condiciones
Mostrar el texto de elegibilidad de la fuente · Texto original del donante (inglés)
Conditions
1. Admissibility conditions: Proposal page limit and layout
described in Appendix 8 of Work Programme - Chips for Europe Initiative call document.
Proposal page limits and layout: described in Part B of the Application Form available in the Submission System.
2. Eligible countries
described in Appendix 8 of Work Programme - Chips for Europe Initiative.
3. Other eligibility conditions
Appendix 8 of Work Programme - Chips for Europe Initiative.
4. Financial and operational capacity and exclusion
described Appendix 8 of Work Programme - Chips for Europe Initiative.
5a. Evaluation and award: Submission and evaluation processes
described Appendix 8 of Work Programme - Chips for Europe Initiative and the Online Manual.
5b. Evaluation and award: Award criteria, scoring and thresholds
described Appendix 8 of Work Programme - Chips for Europe Initiative.
5c. Evaluation and award: Indicative timeline for evaluation and grant agreement
described in Appendix 8 of Work Programme - Chips for Europe Initiative.
6. Legal and financial set-up of the grants
described Appendix 8 of Work Programme - Chips for Europe Initiative.
Call Details
Call document and annexes:
Model Grant Agreements (MGA)
DEP MGA
Additional documents:
DEP Regulation 2021/964
EU Financial Regulation 2024/2509
EU Grants AGA — Annotated Model Grant Agreement
Funding & Tenders Portal Online Manual
Funding & Tenders Portal Terms and Conditions
Funding & Tenders Portal Privacy Statement